| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device using a package which can realize reduction in size and a sophisticated function while suppressing the manufacturing time and cost thereof, and also to provide a method of manufacturing the same semiconductor device. <P>SOLUTION: The semiconductor device comprises a substrate, a first semiconductor including a semiconductor chip which is allocated over the principal surface of the substrate and resin sealed, a mounting substrate, a spacer allocated between the mounting substrate and the substrate, and a second semiconductor. In this case, the second semiconductor is allocated through electrical connection with the mounting substrate within a space formed by the mounting substrate, first semiconductor, and spacer. Moreover, the spacer is allocated to electrically connect the first semiconductor and the mounting substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
