| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method and a sealing device which are capable of sealing up an electronic component with resin and reducing the power consumption of a heater efficiently. SOLUTION: A flexible heater 7B can be provided to a middle mold 3 independently of the length (thickness) of the middle mold 3 in a perpendicular direction, at least freely deformed corresponding to the required shape (cavities 15 and the like) of the middle mold 3, and held releasing heat uniformly with high accuracy. The heater 7B is provided to heat the cavities 15 to a resin molding temperature efficiently. COPYRIGHT: (C)2004,JPO&NCIPI |
