| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mount crystal oscillator wherein an IC chip is fixed to an inner bottom face of a main package by using bumps and the height of which is particularly decreased. SOLUTION: The surface mount crystal oscillator wherein the IC chip is fixed to the inner bottom face of the main package having a recessed part by using the bumps by means of e.g., ultrasonic thermocompression bonding and a crystal piece from an outer circumferential part of which lead electrodes are extended is contained in the recessed part, is configured such that the crystal piece is interposed between the inner bottom face of the package main body and the IC chip to fix the outer circumferential part from which the lead electrodes are extended. COPYRIGHT: (C)2004,JPO&NCIPI
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