发明名称 |
Cooling element for high temperature devices |
摘要 |
A cooling element for cooling an electronic device in an apparatus includes a cover portion configured to cover the device, the cover portion having a top surface. A plurality of fins are positioned on the top surface of the cover portion. Each of the plurality of cooling fins are substantially parallel to each other, and each of the plurality of cooling fins has a middle portion wider than each end portion.
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申请公布号 |
US2004174678(A1) |
申请公布日期 |
2004.09.09 |
申请号 |
US20030382100 |
申请日期 |
2003.03.06 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOSHIBA TEC KABUSHIKI KAISHA |
发明人 |
KOJIMA TAKAHIRO |
分类号 |
H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/467 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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