| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device that can demonstrate sufficient luminous intensity without requiring a special manufacturing step and emit homogeneous light without uneven color. <P>SOLUTION: A rectangular parallelepiped transparent construction 5 is adhered to the side of a sapphire substrate 3A by means of an adhesive layer 4, and the transparent construction 5 is fixed to a cup 2B. Thus, an LED chip 3 and lead frames 2A and 2C can be easily connected with each other. No high positioning during bump formation step or mounting of the LED chip 3 accompanied with flip chip joint is required so that the manufacturing step can be simplified. Therefore, the cost can be reduced and the productivity be also improved. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
