| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck that makes a chucked-wafer releasing process easier and, in addition, minimizes the occurrence of particles on the rear surface of a wafer. SOLUTION: This electrostatic chuck is formed in a bipolar type or unipolar type and has an insulating block 1 provided with a plurality of embossments 2 on its upper surface. Thin metallic electrodes 3 are respectively provided on the embossments 2 and connected to each other through a metallic wire 5 connected to a DC voltage supplier 6. In addition, thin dielectric layers 4 are respectively provided on the metallic electrodes 3. Moreover, a metallic plate 8 covers the upper surface of the insulating block 1 except the positions of the embossments 2. The metallic plate 8 is set in an electrically grounded state or electrically floating state and electrically insulated from the metallic electrodes 3. The insulating block 1 having the above-described structure is disposed on a metallic block 9. COPYRIGHT: (C)2004,JPO&NCIPI |
