| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method with which even in the case of using low viscosity soldering paste to a work, a reflow-soldering having very high reliability can be realized with a light beam soldering method to a small-sized chip member. SOLUTION: In a temperature-rising process A, the temperature is slowly raised and the viscosity of the soldering paste is made to high and thereafter, the light beam is applied to the soldering paste, and the soldering paste is heated and the reflow-soldering is performed. COPYRIGHT: (C)2004,JPO&NCIPI |
