| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing device that can polish a wafer and, at the same time, can surely transport the wafer at the time of ending or starting the polishing. <P>SOLUTION: This wafer polishing device polishes the wafer held by a wafer carrier by bringing the wafer into contact with a rotating polishing pad while supplying slurry. The wafer carrier has a back plate 22 which imparts a pressing force to the wafer, a retainer ring 23 which presses the polishing pad by controlling the radial movement of the wafer, and a protective sheet 24 which has a suction port 24A for sucking the wafer and transmits the pressing force from the back plate 22 to the wafer by coming into contact with the wafer. At the portion of the back plate 22 corresponding to the suction port 24A of the protective sheet 24, an air hole 22B is formed for discharging a fluid and sucking the fluid. A sheet material 70 having a through hole 70A at the position corresponding to the suction port 24A of the protective sheet 24 is provided in contact with the upper surface of the protective sheet 24 or the lower surface of the back plate 22. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
