| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which simplifies a manufacturing process, improves its stability more in a manufacturing process so as to improve the semiconductor devices in manufacturing yield, and furthermore selects permanent boards complying with various requirements such as a reduction in manufacturing cost, an improvement in heat releasing effect, and an increase in conductivity so as to reinforce and improve the characteristics of the semiconductor device. SOLUTION: Semiconductor device structures are made to grow on a temporary board, the temporary board is cleaved and divided into discrete blocks, the permanent board is pasted on the discrete block and turned upside down, the temporary board is separated off, and the semiconductor device is formed on the permanent board through a semiconductor device manufacturing process. COPYRIGHT: (C)2004,JPO&NCIPI |
