| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit test probe constituted of an elongated screw machining contact biased by a coil spring and attached to a through hole of a non-conductive substrate. SOLUTION: One end part of the contact is provided with a crown engaged with a solder ball lead of an IC package, and the contact is provided with an intermediate collar for maintaining the contact inside the through hole. The coil spring is arranged around the contact, and one end part thereof is engaged with a lower end of the collar. The other end of the coil spring has a contact coil, and has a reduced diameter to be projected over a lower end of the non-conductive substrate so as to contact electrically with a printed wiring board. When the test probe is compressed between the IC package and the printed wiring board, inherent twisting of the coil spring inclines the contact to generate electric contact with the contact coil, and a direct electric route is established between the IC package and the printed wiring board, by the minimum resistance and the minimum inductance. COPYRIGHT: (C)2004,JPO&NCIPI |
