| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor where a highly uniform protecting film can be easily formed on the backside and side faces of this semiconductor chip, and even when the backside of the chip is formed with any fine scar due to machine grinding, any adverse effect due to such scar can be prevented. SOLUTION: This method for manufacturing a semiconductor chip comprises processes for holding a semiconductor chip in the exposed status of the backside and side faces of the chip, and for adhering a sheet for forming a hard protecting film to the backside and side faces of the semiconductor chip by a compression bonding, vacuum suction and sheet reduction means or the like, and for cutting the sheet for generating the protecting film in order to divide it into respective semiconductor chips and for curing the sheet for forming the protecting film. Thus, it is possible to provide the semiconductor chip whose backside and side faces are sealed with resin. COPYRIGHT: (C)2004,JPO&NCIPI
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