Memory component repair method for determining a repair solution for a memory device in a test system tests areas of the memory device in sequence for error data

摘要

Error locations (FA) are generated from locations in memory areas and associated error data. Error location values indicate defective areas in a memory device (21). The error locations are stored in an error location memory (26) in a test system with a test device (20). Using the stored error locations determines a repair solution. Independent claims are also included for the following: (a) A test device for determining a repair solution for a memory device connected to the test device; (b) and for a test system with a test device; (c) and for a memory device with a test circuit.