发明名称 MULTILAYER SUBSTRATE FOR HIGH FREQUENCY RF MODULE
摘要 PROBLEM TO BE SOLVED: To surely prevent noise from the other wiring or circuit component from being superimposed on a circuit component or the like for processing a signal of 1.5 GHz band in a multilayer substrate for a high frequency RF (radio frequency) module equipped with a circuit module for receiving the signal of 1.5 GHz transmitted from a GPS satellite and down converting the signal into a signal of a band of several tens MHz. SOLUTION: In a multilayer substrate 10 for the high frequency RF module equipped with a high frequency RF circuit 3 for receiving the signal of 1.5 GHz transmitted from a GPS satellite 1, a down converter circuit 4 for converting the received signal of 1.5 GHz received from the high frequency RF circuit into the signal of the band of several tens MHz and a signal processing circuit 5 for applying required processing to the signal of the band of several tens MHz converted by the down converter circuit, a wiring pattern is not disposed on a boundary surface between a top layer 10a and the next layer 10b at least in the multilayer substrate positioned under the high frequency RF circuit. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004254252(A) 申请公布日期 2004.09.09
申请号 JP20030045114 申请日期 2003.02.21
申请人 TOYO COMMUN EQUIP CO LTD 发明人 OINUMA YUICHI
分类号 H05K3/46;G01S19/37;H04B1/10;(IPC1-7):H04B1/10;G01S5/14 主分类号 H05K3/46
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