发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To allow a light receiving section to efficiently receive the light condensed by an in-layer lens. <P>SOLUTION: A semiconductor device comprises a plurality of light receiving sections 12 formed above a semiconductor substrate 11, a transparent film 20 where steps are formed such that a portion above each light receiving section 12 may be concave and which has an opening 19a corresponding to each light receiving section 12 in each concave section and which is formed over the openings 19a, and a plurality of in-layer lenses 21a formed on top of the transparent film 20 to condense light in each light receiving section 12 corresponding to each opening 19a via each opening 19a. Each in-layer lens 21a is formed at a prescribed position above the corresponding opening 19a. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004253573(A) 申请公布日期 2004.09.09
申请号 JP20030041791 申请日期 2003.02.19
申请人 SHARP CORP 发明人 NAKAI JUNICHI
分类号 H01L27/14;H01L27/148;H01L31/0232;H01L31/10;H04N5/335;H04N5/369 主分类号 H01L27/14
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