| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device where many electrodes for connecting to external circuits are arranged inside a semiconductor chip size. <P>SOLUTION: The many electrodes connected to the lead frame and the bonding pads of a semiconductor chip are connected by using a lead frame smaller than the bonding size of the semiconductor chip, and therewith the semiconductor chip and the lead frame that are integrally formed are packaged by exposing only the surfaces of the electrodes connected to the lead frame to the resin surface and covering them by a sealing resin. After packaging, a number of the electrodes electrically independent are formed by cutting off an electrode supporting part latching each of the electrodes. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
