THICK FILM DIELECTRIC PASTE AND THICK FILM CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a thick film dielectric paste containing a lead-free glass powder, from which a good thick film dielectric can be formed even when it is fired in a nitrogen atmosphere at 500-700°C.

SOLUTION: The thick film dielectric paste is obtained by dispersing the lead-free glass powder and a resin in an organic solvent and forms a film when it is fired in a nitrogen atmosphere at 500-700°C. The resin contains 8-20 wt.% poly(α-methylstyrene) and 0.1-1 wt.% acrylic to the total weight of the thick film dielectric paste. Thereby, the thick film dielectric formed by firing can be formed as a dense film. Further, it is characterized in that the iron content in the thick film dielectric paste is ≤300 ppm. Thereby, discoloration of the thick film dielectric formed by firing can be suppressed.

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