| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for surface mounting which has a leadless structure allowing its thickness to be made small with a low cost and has an excellent strength, and also to provide a method for manufacturing the device. <P>SOLUTION: The manufacturing method comprises a substrate formation step of partially forming conduction parts 20 on an adhesive layer of an adhesive sheet, a semiconductor element mounting step of fixedly mounting a semiconductor element 10 on one side of a substrate not provided with its electrodes and electrically connecting upper sides of the plurality of conduction parts 20 and the electrodes 11 of the semiconductor element 10 by wires 30, a resin sealing step of sealing the element 10, the wires 30, and the conduction parts 20 with a resin 40 to form the semiconductor device, and a sheet separating step of separating the adhesive sheet from the semiconductor device. Since the conduction part 20 has such a shape as to have an extension 20a, the junction strength between the conduction parts 20 and the sealing resin 40 can be increased. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
