| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve internal component arrangement density of a semiconductor device in which circuit components such as a semiconductor chip, a resistor and a capacitor are intermingled on a metal frame. <P>SOLUTION: A semiconductor chip 2 is mounted on one surface of a metal frame 1 forming a conducting path, which surface is sealed with mold resin 4. The other surface opposite to the surface on which the semiconductor chip is mounted is in a state that the metal frame is exposed from the resin, and makes a form on which circuit components 3 like a capacitor which does not need resin sealing can be mounted. Structure for mounting the circuit components is formed, and both surfaces of the metal frame can be used as component mounting surfaces, so that packaging density of components can be improved. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
