| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-shaped adhesive that maintains its heat resistance, even if its glass transition temperature is lowered, exhibit a good flowability at the time of bonding and has a good storability. SOLUTION: The film-shaped adhesive which is supported on a substrate and is used for bonding a semiconductor element to a leadframe in the fabrication process of a semiconductor device is manufactured by casting on the substrate a polyimide resin which is a polyimide obtained by reacting at least one diamine compound selected from a diaminopolysiloxane, an aromatic diamine and an aliphatic diamine with an aromatic tetracarboxylic acid anhydride and contains≥1 mol.% of the structure as expressed by formula (2) among the total -NH-R-NH- (wherein R is a residue after two NH<SB>2</SB>'s are removed from the diamine compound). COPYRIGHT: (C)2004,JPO&NCIPI
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