发明名称 MODULE COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a module component for a switching power supply with high heat radiation using resin, capable of attaining reduction in material cost and man-hours by using a sealant without using a sealing plate as a means for preventing resin leakage. SOLUTION: This module component for a switching power supply is structured so as not to leak a filling material by using a sealant for preventing resin leakage, without using a sealing plate for preventing resin leakage. By this constitution, the use of the sealing plate for preventing resin leakage can be eliminated, thus providing cost reduction. It is also possible to obtain the module component for the switching power supply capable of improving workability. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004254397(A) 申请公布日期 2004.09.09
申请号 JP20030041105 申请日期 2003.02.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SEKO HISATAKA;HASHIMOTO FUMIAKI;SUZUKI MICHIYA;MAEDA TAKESHI
分类号 H02M3/00;(IPC1-7):H02M3/00 主分类号 H02M3/00
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