| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for easily specifying a process/device causing problems in a process for manufacturing a thin film device. SOLUTION: A defective-process specifying system 110 in a process for manufacturing a semiconductor wafer has the steps of inputting inspection information from inline inspecting devices 102a, 102b, automatically detecting an abnormality by use of defective position information or external information, downloading and analyzing required information such as device evaluation information 106, product inspection information 107, manufacturing route information 108 from an upper data base 105 for abnormality, and specifying the defective process/device. This automatically detects the abnormality triggered by an input of inline inspection information, and downloads and analyzes the required information from the upper data base 105, which allows an operator not to select an analysis objective, and the defective process/device can be easily specified. COPYRIGHT: (C)2004,JPO&NCIPI
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