发明名称 PRINTED WIRING BOARD, MODULAR COMPONENT USING IT, AND METHOD FOR MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board which can be manufactured with at a few processes and is excellent in productivity, and provide a modular component using the printed wiring board and a method for manufacturing the printed wiring board. SOLUTION: In the printed wiring board 12, protruding parts 11 composed of a metal material are formed on a prescribed part of a wiring pattern formed on a substrate 10, and the dispersion of the height of the protruding parts 11 is made at most±5μm. Gaps between an external electrode of a mounted electronic component and the protruding parts 11 can be made small, so that the reliability of connection is improved. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004253433(A) 申请公布日期 2004.09.09
申请号 JP20030039329 申请日期 2003.02.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAGI YUJI
分类号 H05K3/34;H01L21/60;H01L25/04;H01L25/18;H05K3/24;(IPC1-7):H05K3/34 主分类号 H05K3/34
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