| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor element accommodating package which can be effectively restrained from being deformed by screws for fastening the package or by heat released from an operating optical semiconductor element so as to be superior in optical coupling efficiency. SOLUTION: The optical semiconductor element holding package is equipped with almost a metal rectangular parallelepipedic base 1 which is equipped with a through-hole 1d at its center, and four screw fixing parts 1b which are each located at corners, a mounting board 1-A which is fitted in the through-hole 1d and where an optical semiconductor element 10 is mounted and fixed on its top surface, a metal frame 2 which is joined to the outer periphery of the upper main surface of the base 1 inside the screw fixing parts 1b so as to surround the through-hole 1d and equipped with a through-hole 2a bored in its side, and a cylindrical optical fiber fixing member 3 fitted in the through-hole 2a. The screw fixing part 1b and the mounting board 1-A are thinner than a part of the base 1 where the frame 2 is joined, and the mounting board 1-A has a larger modulus of longitudinal elasticity than the base 1. COPYRIGHT: (C)2004,JPO&NCIPI
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