| 摘要 |
When separating an IC component (1) from a board (3), there are the processes of positioning a tool (21) just above the IC component, thereafter moving down the tool into a specified position, making the tool cover the IC component that is mounted on the board via an adhesive material, solder, or paste, and separating the IC component from the board by turning the tool. Through these processes, the IC component can be separated with a relatively small force, so that the crack of the IC component and the damage of the board can be suppressed to a minimum. <IMAGE> |
