| 发明名称 |
CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND MOLDING THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition excellent in moldability in a mold and capable of giving a cured product having excellent heat resistance and hot-water resistance and having a high conductivity. <P>SOLUTION: The curable composition essentially consists of (A) a hydrocarbon compound having a plurality of carbon-to-carbon double bonds and (B) a carbonaceous material. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004250661(A) |
申请公布日期 |
2004.09.09 |
| 申请号 |
JP20030173155 |
申请日期 |
2003.06.18 |
| 申请人 |
SHOWA DENKO KK |
发明人 |
KADOWAKI ETSUKO;IINO TADASHI;UCHIDA HIROSHI;KUMAKI TERUTOSHI;SEKI KENTARO |
| 分类号 |
C08L9/00;B82Y30/00;C08F290/04;C08K3/04;H01M8/0221 |
主分类号 |
C08L9/00 |
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