| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily wire-bond a semiconductor light emitting element of a semiconductor light emitting device provided with a reflector reflecting light irradiated from the semiconductor element fixed on a supporting plate. <P>SOLUTION: An inner hollow (3a) formed in the reflector (3) of the semiconductor light emitting device is provided with an optical reflective inclined face (3b) having an opening cross section which expands to a direction detached from the supporting plate (1). A conductive joint member (9) embedded in the reflector (3) is provided with an inner end (9a) which is exposed into the inner hollow (3a) of the reflector (3) and is electrically connected to the electrode of the semiconductor light emitting element (2) by a lead wire (8), and an outer end (9b) which is exposed to an outer side of the reflector (3) from an outer peripheral part (3g) of the reflector (3) and is electrically connected to wiring conductors (4 and 5). Since the inner end (9a) of the joint member (9) is exposed into the inner hollow (3a) of the reflector (3) and the semiconductor light emitting element 2 and the joint member (9) can closely be arranged, the electrode of the semiconductor light emitting element (2) and the joint member (9) can easily be connected by the short lead wire (8) at the time of wire bonding. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
