| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing device that can polish a wafer under a dynamic pressure and can surely transport the wafer at the time of ending or starting the polishing. <P>SOLUTION: This wafer polishing device polishes the wafer held by a wafer carrier by bringing the wafer into contact with a rotating polishing pad while supplying slurry. The wafer carrier has a back plate 22 which imparts a pressing force to the wafer, a retainer ring 23 which presses the polishing pad by controlling the radial movement of the wafer, and a protective sheet 24 which has a suction port for sucking the wafer and transmits the pressing force from the back plate 22 to the wafer by coming into contact with the wafer. Between the back plate 22 and the retainer ring 23, a fluid shut-off mechanism 50 is provided which communicates the space formed of the back plate 22 and the protective sheet 24 with the outside air at the time of pressing the wafer and isolates the space from the outside air at the time of sucking the wafer. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
