发明名称 BONDING APPARATUS AND BONDING APPEARANCE INSPECTION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To prevent displacement of an image which is generated when a focal point position of an optical measurement apparatus is changed in a bonding apparatus. <P>SOLUTION: In a wire bonder 50, the light beam 66 emitted from a substance over a placing board 60 reaches an imaging camera 70 as the light beam 68 passing through a parallel flat plate passing light path 80 for changing the light path length. The parallel flat plate passing light path 80 comprises, in the light path thereof, a half mirror 82, a parallel flat plate 86, and a reflecting mirror 88 which is allocated in vertical to the optical axis of the light beam 96 having passed the parallel flat plate 86 to return again the light beam 96 to the parallel flat plate 86 as the reflected light beam 98 through the mirroring manipulation to this light beam 96. The light beam 66 from the substance once passes the parallel flat plate 86 and then passes again the parallel flat plate 86 through the mirroring manipulation at the surface vertical to the light axis. Accordingly, deviation of image which is generated because the light beam passes the parallel flat plate 86 can be canceled. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004253521(A) 申请公布日期 2004.09.09
申请号 JP20030040856 申请日期 2003.02.19
申请人 SHINKAWA LTD 发明人 HARAGUCHI MANABU
分类号 H01L21/66;B23K20/00;B23K31/12;H01L21/00;H01L21/60 主分类号 H01L21/66
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