| 摘要 |
PROBLEM TO BE SOLVED: To provide solder paste that has the ability to secure a lowered height as well as reliability for conductive connection and also to provide an electrically conductive connection structure in which such lowered height and reliability are secured. SOLUTION: In the solder paste for the purpose of connecting the electrode of a semiconductor chip or that of an electronic component for example to the electrode of a mounting substrate, there are dispersed in the flux electrically conductive fine particles in which one or more metallic layers with solder in the outermost layer are formed on the surface of resin-made substrate fine particles. In the electrically conductive connection structure, the electrode of a semiconductor chip or that of an electronic component for example is connected to the electrode of the mounting substrate using the solder paste. COPYRIGHT: (C)2004,JPO&NCIPI |
