| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin film having a low coefficient of thermal expansion and good workability in a metal plating, and to provide a multilayer printed wiring board containing an insulating layer formed by curing of the resin film. <P>SOLUTION: [1] The resin film comprises an epoxy resin (A) containing at least two glycidyl groups in the molecule, an epoxy resin curing agent (B), a thermoplastic resin (C) and a filler (D), and the film is characterized by a lower filler (D) content in at least one terminal area of a section of the film compared with a filler (D) content in a central area of a section of the film in the Z-axis direction. [2] The resin film described in [1] is alternatively characterized by that the filler (D) exists in a low concentration distribution in one terminal area and in a high concentration distribution in the other terminal area of the film in the Z-axis direction. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
