| 摘要 |
PROBLEM TO BE SOLVED: To prevent deposition substrates 14 from being broken by preventing direct contact between sides of the adjacent deposition substrates 14, 14. SOLUTION: The deposition substrates 14 are conveyed into/out of an apparatus and dipped in molten metal in the apparatus to have molten object substances deposited on a surface 14a of each deposition substrate 14 for obtaining deposited plates 2. The deposition substrates 14 each comprise the substrate surface 14a to be dipped in the molten metal, and projections 14c, 14c which are formed on opposite sides in a conveying direction. COPYRIGHT: (C)2004,JPO&NCIPI
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