发明名称 High polymer plate and conductive plate connecting body, and part using the connecting plate
摘要 A high polymer plate and conductive plate connecting body formed by connecting a high polymer plate to a conductive plate without using an adhesive agent and a part using the high polymer plate and conductive plate connecting body; the connecting body, wherein the faces of the high polymer plate and the conductive plate opposed to each other are connected to each other after the plates receive an activation under an extremely low pressure; a part.
申请公布号 US2004175583(A1) 申请公布日期 2004.09.09
申请号 US20040472000 申请日期 2004.05.03
申请人 SAIJO KINJI;YOSHIDA KAZUO;OKAMOTO HIROAKI;OHSAWA SHINJI 发明人 SAIJO KINJI;YOSHIDA KAZUO;OKAMOTO HIROAKI;OHSAWA SHINJI
分类号 B32B15/08;B32B15/20;B32B27/06;H05K3/02;H05K3/38;(IPC1-7):B32B15/08 主分类号 B32B15/08
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