发明名称 |
High polymer plate and conductive plate connecting body, and part using the connecting plate |
摘要 |
A high polymer plate and conductive plate connecting body formed by connecting a high polymer plate to a conductive plate without using an adhesive agent and a part using the high polymer plate and conductive plate connecting body; the connecting body, wherein the faces of the high polymer plate and the conductive plate opposed to each other are connected to each other after the plates receive an activation under an extremely low pressure; a part.
|
申请公布号 |
US2004175583(A1) |
申请公布日期 |
2004.09.09 |
申请号 |
US20040472000 |
申请日期 |
2004.05.03 |
申请人 |
SAIJO KINJI;YOSHIDA KAZUO;OKAMOTO HIROAKI;OHSAWA SHINJI |
发明人 |
SAIJO KINJI;YOSHIDA KAZUO;OKAMOTO HIROAKI;OHSAWA SHINJI |
分类号 |
B32B15/08;B32B15/20;B32B27/06;H05K3/02;H05K3/38;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|