发明名称 FEEDTHROUGH INTERCONNECTION ASSEMBLY
摘要 The present invention relates to optimization of communication equipment with respect to size and undesired signal interference. To this aim a ceramic feedthrough interconnection assembly is proposed in order to transport an electrical information signal to and from a communication capsule. In addition to at least one signal lead ( 103 a, 103 b) for communicating an electrical information signal, the assembly contains at least one auxiliary lead and a shield ( 103 c, 103 d, 104, 104 a, 104 b, 104 f) that electrically shields the at least one signal lead ( 103 a, 103 b) from the at least one auxiliary lead. The shield ( 103 c, 103 d, 104, 104 a, 104 b, 104 f) has such dimensions (d<SUB>1</SUB>, d<SUB>2</SUB>) and is positioned at such distance (d<SUB>3</SUB>, d<SUB>4</SUB>, d<SUB>12</SUB>) from the at least one signal lead ( 103 a, 103 b) that the electrical information signal experiences a well-defined and substantially constant impedance in the assembly. This in turn, minimizes the risk of undesired signal reflections. At the same time the assembly allows a high lead density, i.e. short distances between the leads.
申请公布号 EP1454514(A1) 申请公布日期 2004.09.08
申请号 EP20020793605 申请日期 2002.12.05
申请人 OPTILLION AB 发明人 LINDBERG, LARS;SVENSON, LARS-GOETE;GOOBAR, EDGAR
分类号 H05K1/02;G02B6/42;H05K9/00;(IPC1-7):H05K1/02;H01S5/02;H01L23/66 主分类号 H05K1/02
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