| 发明名称 |
DUAL CURE B-STAGEABLE ADHESIVE FOR DIE ATTACH |
| 摘要 |
<p>Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.</p> |
| 申请公布号 |
EP1453924(A2) |
申请公布日期 |
2004.09.08 |
| 申请号 |
EP20020793971 |
申请日期 |
2002.11.18 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
BECKER, KEVIN, HARRIS;KUDER, HARRY, RICHARD |
| 分类号 |
C09J201/00;C08G59/40;C08J3/24;C09J5/00;C09J11/06;C09J163/00;H01L21/52;H01L21/58;(IPC1-7):C09J4/00 |
主分类号 |
C09J201/00 |
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代理人 |
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