发明名称 |
Positive resist composition and base material carrying layer of the positive resist composition |
摘要 |
A positive resist composition includes (A) an alkali-soluble polysiloxane resin, (B) an acid generator composed of a compound which generates an acid upon irradiation of active light or radiant ray, and (C) a compound in which at least one hydrogen atom of phenolic hydroxyl group or carboxyl group is substituted with an acid-decomposable group. This positive resist composition is useful for processes using F2 excimer laser (157 nm), extreme-ultraviolet rays (EUV, vacuum ultraviolet rays; 13 nm) and other light sources having wavelengths equal to or shorter than that of KrF excimer laser, and has high definition and can form resist patterns with good sectional shapes. A base material carrying a layer of the positive resist composition is also useful.
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申请公布号 |
US6787284(B2) |
申请公布日期 |
2004.09.07 |
申请号 |
US20010922723 |
申请日期 |
2001.08.07 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
OGATA TOSHIYUKI;ENDO KOUTARO;KOMANO HIROSHI |
分类号 |
G03F7/039;C08G77/50;C08G77/52;C08L83/06;C08L83/14;G03F7/075;G03F7/11;H01L21/027;(IPC1-7):G03C1/73;G03C1/795;G03F7/09 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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