发明名称 |
Method of fabricating polysilicon film by nickel/copper induced lateral crystallization |
摘要 |
The present invention relates to a method of fabricating polysilicon film by Nickel and Copper induced lateral crystallization for the TFT-LCD, comprising the step of: a) a thin (~4 nm) Copper and Nickel being evaporated onto the substrate; b) a amorphous-silicon film (~50 nm) being evaporated onto thereof obtained according to a); c) applying annealing at less than 600° C. to thereof obtained according to b) for fast fabricating poly-silicon film. It is approximately 10 times faster than that of Ni induced polysilicon. The present invention is to provide a low-temperature (<600° C.) fast growth rate process to convert the hydrogenated amorphous silicon (a-Si:H) films to polysilicon film for substantially time-saving process and industrial applicability.
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申请公布号 |
US6787434(B1) |
申请公布日期 |
2004.09.07 |
申请号 |
US20030428132 |
申请日期 |
2003.05.02 |
申请人 |
NATIONAL TAIWAN UNIVERSITY |
发明人 |
LEE SI-CHEN;HSUCH WEI-CHIEH;CHEN CHI-CHIEH |
分类号 |
C23C14/00;H01L21/00;H01L21/20;H01L21/283;H01L21/331;H01L21/425;H01L21/44;(IPC1-7):H01L21/00 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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