| 摘要 |
A portion, positioned at an opening portion of a resist, of an anti-reflection film is etched using an etching gas containing a substituted hydrocarbon with a halogen. At the time of etching of the anti-reflection film, a carbon component of the substituted hydrocarbon with a halogen is formed as a carbonaceous deposit on side walls, less irradiated with ions, of the opening portion of the resist, and on side walls of an opening portion, formed by etching, of the anti-reflection film. The deposit acts as a side wall blocking film, to suppress lateral extension of the opening portion of the resist and the opening portion of the anti-reflection film by etching, thus allowing anisotropic etching of the anti-reflection film. With this etching method, it is possible to etch the anti-reflection film with a resist taken as a mask while suppressing a variation in pattern dimension.
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