发明名称 |
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication |
摘要 |
Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.
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申请公布号 |
US6788867(B2) |
申请公布日期 |
2004.09.07 |
申请号 |
US20030734075 |
申请日期 |
2003.12.11 |
申请人 |
GEORGIA TECH RESEARCH CORP. |
发明人 |
MULE' TONY;MEINDL JAMES D.;KOHL PAUL;SCHULTZ STEPHEN M.;GAYLORD THOMAS K.;GLYTSIS ELIAS N.;VILLALAZ RICARDO;BAKIR MUHANNAD;REED HOLLIE |
分类号 |
G02B6/12;G02B6/132;G02B6/136;G02B6/138;(IPC1-7):G02B6/00 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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