发明名称 |
Method for clamping and wire-bonding the leads of a lead frame one set at a time |
摘要 |
A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes. |
申请公布号 |
US6786387(B2) |
申请公布日期 |
2004.09.07 |
申请号 |
US20020206291 |
申请日期 |
2002.07.25 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BALL MICHAEL B.;FOGAL RICH |
分类号 |
B23K3/06;B23K20/00;H01L21/607;(IPC1-7):B23K31/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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