发明名称 Heat pipe circuit board
摘要 A heat pipe circuit board comprising: a heat pipe; at least one insulating layer; a circuit pattern provided on a surface of or inside the at least one insulating layer; and electronic components being mounted on the heat pipe through the insulating layer. The heat pipe is formed by jointing two plate members by friction stir welding, at least one of the two plate members being provided with a recess portion which is a fluid channel of a working fluid.
申请公布号 US6788537(B2) 申请公布日期 2004.09.07
申请号 US20030431954 申请日期 2003.05.08
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 SAITA YUKIHIRO;MASHIMO KEIJI
分类号 B23K20/12;B23K101/14;B23K101/42;F28D15/02;H05K1/02;H05K7/20;(IPC1-7):H05K7/20 主分类号 B23K20/12
代理机构 代理人
主权项
地址