发明名称 Positive-working photoresist composition and resist patterning method using same
摘要 The invention discloses a crosslinked chemical-amplification positive-working photoresist composition of good pattern resolution and storage stability, which is suitable for pattern size diminution by the thermal flow process after development. The composition comprises: (A) a polyhydroxystyrene resin substituted for a part of the hydroxyl hydrogen atoms by acid-dissociable solubility-reducing groups; (B) a radiation-sensitive acid-generating compound; (C) a polyvinyl ether compound as a crosslinking agent; (D) a carboxylic acid; and (E) an amine compound.
申请公布号 US6787290(B2) 申请公布日期 2004.09.07
申请号 US20010928430 申请日期 2001.08.14
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 NITTA KAZUYUKI;SATO KAZUFUMI;KAWANA DAISUKE;SHIMATANI SATOSHI
分类号 G03F7/039;C08F2/44;C08F257/00;C08K5/00;C08K5/09;C08K5/17;C08L25/18;G03F7/004;G03F7/40;H01L21/027;(IPC1-7):G03C1/73;G03F7/20;G03F7/30 主分类号 G03F7/039
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