| 摘要 |
To reduce the manufacturing time in a production line for a semiconductor integrated circuit device, plural wafers in a lot are divided into a number of groups according to a selected number of manufacturing devices to be used for further processing of the wafers. Each group of wafers is allocated to a respective one of plural manufacturing devices in a state in which each group is housed in a respective one of plural division carriers and one sheet processing is applied to the wafer groups in the plural manufacturing devices in parallel.
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