| 摘要 |
A device for machining a material with ultrashort laser pulses is described. This device comprises:(a) a device (1) for generating a sequence of first laser pulses, wherethe first laser pulses each have a duration of less than 300 picoseconds andthe repetition rate for the first laser pulses is in the range between 100 kHz and 1 GHz,(b) a converter (2) for converting a first set of the sequence of first laser pulses into a sequence of second laser pulses for application to and for machining of the material, wherethe second laser pulses each have a duration of less than 300 picoseconds andthe repetition rate for the second laser pulses is in the range between 1 Hz and 1 MHz, as well as(c) a testing device (3, 5, 6, 7, 15) that is equipped to apply first laser pulses, which do not belong to the first set, to the material, to detect specific results of this application and to provide these detected results as information.
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