发明名称 Method and system for sensing IC package orientation in sockets
摘要 An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC package in the socket is correct, the other lead of the LED is connected to a ground path on the packaged IC. As a result, the LED is activated indicating the orientation of the packaged IC is correct.
申请公布号 US6786760(B1) 申请公布日期 2004.09.07
申请号 US20030420577 申请日期 2003.04.21
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 BENAVIDES JOHN A.;ADKISSON RICHARD W.
分类号 H05K7/10;(IPC1-7):H01R3/00 主分类号 H05K7/10
代理机构 代理人
主权项
地址