发明名称 |
Method and system for sensing IC package orientation in sockets |
摘要 |
An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC package in the socket is correct, the other lead of the LED is connected to a ground path on the packaged IC. As a result, the LED is activated indicating the orientation of the packaged IC is correct.
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申请公布号 |
US6786760(B1) |
申请公布日期 |
2004.09.07 |
申请号 |
US20030420577 |
申请日期 |
2003.04.21 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
BENAVIDES JOHN A.;ADKISSON RICHARD W. |
分类号 |
H05K7/10;(IPC1-7):H01R3/00 |
主分类号 |
H05K7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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