发明名称 |
Wafer-level inter-connector formation method |
摘要 |
Inter-connectors are typically used for interconnecting electronic components. Interconnections between electronic components are generally classified into at least two broad categories of "relatively permanent" and "readily demountable". A "readily demountable" connector includes a spring-like contact structure of one electronic component for connecting to a terminal of another electronic component. The spring-like contact structure, also known as an inter-connector, generally requires a certain amount of contact force to effect reliable pressure contact to a terminal of an electronic component. Therefore, the shape and metallurgy of the inter-connector are important factors in determining the effectiveness of the inter-connector for making pressure connection to a terminal of the electronic component. Conventional methods of making such an inter-connector use lithographic and planarisation methods to "make" the inter-connectors in segments. This results in the inter-connector segments having joints therebetween. Metallurgically, the joint stress due to joining a pair of inter-connector segments and stress concentration at the joints due forces applied to the inter-connector can lead to the mechanical failure of the inter-connector in Mathieu. An embodiment of the invention uses lithographic techniques and heat treatment methods for forming a structure channel defining the shape and dimension of an inter-connector. The structure channel is then used to "mold" a reproduction of the inter-connector having a single continuous physical segment.
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申请公布号 |
US6787456(B1) |
申请公布日期 |
2004.09.07 |
申请号 |
US20030392084 |
申请日期 |
2003.03.20 |
申请人 |
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
发明人 |
KRIPESH VAIDYANATHAN;IYER MAHADEVAN K;NAGARAJAN RANGANATHAN |
分类号 |
H01L21/48;(IPC1-7):H01L21/476;H01L21/311;H01L21/31;H01L21/469;H01L21/26 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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