CIRCUIT ARRANGEMENT FOR COMPONENTS TO BE COOLED AND CORRESPONDING COOLING METHOD

摘要

The invention proposes a simpler way of removing heat from integrated power components. For this purpose, a heat transfer device, in particular a thermally conducting mat (3), is inserted between the components (2) to be cooled and a core of an inductive component (4). The heat produced by the power semiconductors (2) can thus be dissipated to the core of the inductive component (4).