APPARATUS FOR REMOVING PHOTORESIST FROM SEMICONDUCTOR WAFER WITH POLISHING PAD AND OPERATING METHOD THEREOF

摘要

PURPOSE: An apparatus for removing a photoresist from a semiconductor wafer and an operating method thereof are provided to prevent the contamination due to the photoresist by installing a photoresist removal device at a lateral part of an edge of a wafer. CONSTITUTION: A cleaning pad(110) is installed at one side of a semiconductor wafer. The cleaning pad is adhered to an arm(130). A cleaning solution supply unit(160) is adhered to the arm in order to supply a cleaning solution to the cleaning pad. The cleaning pad is formed with a predetermined material for absorbing the cleaning solution. In addition, the cleaning pad is formed with the predetermined material having the durability, the etching resistance for the cleaning solution, and the abrasion resistance for the surface of the wafer.