发明名称 |
Method of producing piezoelectric component and piezoelectric component |
摘要 |
A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.
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申请公布号 |
US2004169444(A1) |
申请公布日期 |
2004.09.02 |
申请号 |
US20030728540 |
申请日期 |
2003.12.05 |
申请人 |
HIGUCHI MASATO;ARAKI NOBUSHIGE;SHINKAI HIDEKI |
发明人 |
HIGUCHI MASATO;ARAKI NOBUSHIGE;SHINKAI HIDEKI |
分类号 |
H01L23/28;H01L21/56;H01L41/22;H03H3/007;H03H3/08;H03H9/10;H03H9/145;H03H9/25;(IPC1-7):H01L41/053 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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