发明名称 Method of etching metallic materials to form a tapered profile
摘要 A method of fabricating a structure having a tapered profile using a low temperature plasma etch (LTPE) process. In one embodiment, the LTPE process uses a gas comprising carbon tetrafluoride (CF4), trifluoromethane (CHF3), and nitrogen (N2) to fabricate the structure from a material layer of at least one of tantalum (Ta), tantalum nitride (TaN), and the like.
申请公布号 US2004171272(A1) 申请公布日期 2004.09.02
申请号 US20030377852 申请日期 2003.02.28
申请人 APPLIED MATERIALS, INC. 发明人 JIN GUANGXIANG;NALLAN PADMAPANI C.;YAN CHUN;KUMAR AJAY
分类号 C23F4/00;H01L21/3213;H01L21/768;H01L43/12;(IPC1-7):H01L21/302;H01L21/461 主分类号 C23F4/00
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