发明名称 Selbstklebefolie
摘要 An adhesive sheet used for semiconductor wafer processing; with the adhesive sheet consisting of a release liner, an adhesive layer and a base film which are laminated in order of description, having a great length and being folded zigzag into equal sections so that one section is superposed exactly upon another. <IMAGE>
申请公布号 DE69918872(D1) 申请公布日期 2004.09.02
申请号 DE1999618872 申请日期 1999.01.20
申请人 LINTEC CORP., TOKIO/TOKYO 发明人 MATSUMOTO, MASATOSHI;MOIKE, MITSUGU;MARUHASHI, HITOSHI;MINEURA, YOSHIHISA
分类号 C09J7/02;C09J121/00;C09J133/00;C09J183/04;C09J201/00;H01L21/68;H01L21/683;(IPC1-7):C09J7/02 主分类号 C09J7/02
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